您的位置:91购物  >  文体  >  按需印刷图书Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement[9780367023430]
按需印刷图书Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement[9780367023430]

    按需印刷图书Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement[9780367023430] - 上海外文图书音像专营店

    券后价¥2,105领优惠券¥80

    原价:2185元9.63折距离结束:

    去天猫抢购>>收藏

    扫码有惊喜!

    扫码进入手机查看
    • 宝贝详情

    HOT同类热卖

      L
      o
      a
      d
      i
      n
      g
      .
      .
      .

    91购物  桂ICP备2023004367号  Copyright © 2010 - 2019 https://www.91gouwu.com/ All Rights Reserved